A versatile wafer bonding system capable of handling substrate sizes ranging from small pieces up to 200 mm.
Max contact force: 10, 20, 60 kN - Single chips processing - Manual loading chamber - Vacuum :Standard: 0.1 mbar
We firmly believe that one of the Group’s strengths lies in the transdisciplinary approach that stems from active collaboration between experts from different fields, crucial for achieving results in both research and technological transfer.
