Reactive Ion Etching (RIE)

Advanced Vacuum, Vision 320
PiQuET Laboratory, Lab S3, ISO6
The Advanced Vacuum Vision 320 is a manual load, parallel plate reactive ion etcher configured for fluorine based etching.
Electrode Size Electrode Temperature Electrode Material: 12" (305 mm) diameter, Aluminum with Graphite Cover - RF Electrode Bias: 600 W power supply, 13.56 MHz - Base Pressure: <1x10e-6 Torr - Pressure Control: Automatic, 0 – 1 Torr - Process Gas Lines (Digital MFCs): SF6, CHF3, O2, N2 - Control System Software: PLC (XP/Windows 7), with data logging - Available process gases (fluorine chemistry) : SF6, CHF3, O2 and Ar. Separate mass-flow controller (MFC) for each gas - Pressure control pressure controlled separately by an APC valve between the chamber and the turbo-pump - Pumping system turbomolecular and mechanical pump in sequence, both purged by nitrogen; ultimate vacuum: 10-6 Torr - Substrate temperature control at 20 °C
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