This machinery is an advanced XeF2 etch system designed for intensive R&D and pilot production, particularly for releasing MEMS devices. Its key benefits include a patented dual expansion chamber design that allows for high etch rates and precise gas flow without carrier gas dilution. It supports both pulsed and continuous flow etch processes.
Etching chamber is closed buy a transparent lid, to allow inspection of the samples. Vapor pressure at ~4T at room temperature.
