The NXQ4006 Mask Aligner combines innovative design with precision alignment and exposure features. The versatility of the NXQ4006 makes it an ideal tool for manufacturing and R&D activities, for a wide range of technologies. It supports Soft/Hard pressure contact and Vacuum contact printing. The system can also print in Manual Proximity mode after leveling between the wafer and mask. It can process partial and whole substrates up to 150 mm (6”).
Maximum Substrate Size: 6ʺ Diameter - NXQ VideoView Splitfield Microscope, two high definition color cameras and dual HD Monitors, 5x offset objective pair, LED through objective illumination, motorized ocus - Manual tray load for substrate load/unloading - Automatic Wafer Planarization (WEC): automatically performs wedge error compensation and moves to align gap after WEC - New mask image stored for every wafer to ensure accuracy, 5x objectives and high definition color cameras with up to 320x magnification - UV Exposure Optics ‐ 350 / 500 Watts - Standard Broadband Exposure Optics (350nm‐450nm) - High Resolution, low diffraction optics with integration and collimation for improved print resolution
