It combines a traditional thermal emission scanning electron microscope (SEM) with a focused ion beam (FIB), offering a comprehensive suite of capabilities: it allows for high-resolution imaging, elemental analysis (not available now no EDS), precise material removal or modification using focused ion beams, TEM sample preparation (TEM Lamella), observations in 2D and 3D (tomography), cross-section imaging to explore the subsurface of specimens, and structural modification of sample surfaces at the micrometer to nanometer scale.
Max sample dimension: 50 mm x 50 mm x 50 mm - Working temperature: Room Temperature - Pressure range: High vacuum: < 6x10^-4 Pa; Low vacuum: 10 Pa - 130 Pa; ESEM - vacuum: 10 Pa - 4000 Pa - E-gun source: Schottky-emitter electron source always ON tungsten tip ZrO2 covered. - FIB gun source: Ga liquid metal - Operating HT: 1kV~30kV - Detectors and Attachments: Everhardt-Thornley SEDLow-vacuum SED (used in low vacuum) - Gaseous SED (GSED) (used in ESEM mode) - Solid-State BSED - Electron beam resolution: High-vacuum 1.2 nm at 30 kV (SE) - 2.5 nm at 30 kV (BSE) - 2.9 nm at 1 kV (SE) - Low-vacuum 1.5 nm at 30 kV (SE) 2.5 nm at 30 kV (BSE) 2.9 nm at 3 kV (SE) - Extended low-vacuum mode (ESEM) 1.5 nm at 30 kV (SE) - Focus Ion Beam resolution:7 nm at 30 kV at beam coincident point - Gas Injection Systems: Pt, Carbon, XeF2.
