Portable diagnostic tests, electronic devices, and microfluidic platforms share a dependence on their form for usability. The study of the package is therefore crucial in the manufacturing of prototypes. While in the past it was seen only as protection, today packaging can act as an active interface with the external environment. Therefore, it requires innovative production processes and technological standards. In particular, the future of microelectronics requires the study of materials, processes and instrumentation to create heterogeneous integrated devices according to the System In Package (SiP) philosophy, i.e. capable of assembling multiple functions operated by single chips in a single device , fabricated on different semiconductors. In its technology portfolio, the group has dedicated equipment such as additive manufacturing, assembly technologies and characterization tools.
