In the field of microelectronics, the growing need for integration requires scrupulous design and careful choice of materials. Co-design allows such engineering by parallelizing design and simulation. Thermal dissipation, mechanical behavior or electromagnetic compatibility can be addressed right from the first project draft with a notable saving of resources in the creation of optimized devices. Dedicated characterization tools provide useful data for simulation purposes. Before obtaining the physical device, the available software, through multiphysics interfaces, also allow the evaluation of multiple simultaneous phenomena in the study of the virtual device. For example, these analyses enable the estimation of stress in components, or the formation of hot spots.
